by Keyword: Dissolution

Vukomanovic, M, Gazvoda, L, Kurtjak, M, Hrescak, J, Jaklic, B, Moya-Anderico, L, Cendra, MD, Torrents, E, (2022). Development of a ternary cyclodextrin-arginine-ciprofloxacin antimicrobial complex with enhanced stability Commun Biol 5, 1234

Designing useful functionalities in clinically validated, old antibiotics holds promise to provide the most economical solution for the global lack of effective antibiotics, as undoubtedly a serious health threat. Here we show that using the surface chemistry of the cyclodextrin (beta CD) cycle and arginine (arg) as a linker, provides more stable ternary antibiotic complex (beta CD-arg-cpx). In contrast to classical less stable inclusion complexes, which only modify antibiotic solubility, here-presented ternary complex is more stable and controls drug release. The components of the complex intensify interactions with bacterial membranes and increase the drug's availability inside bacterial cells, thereby improving its antimicrobial efficacy and safety profile. Multifunctional antibiotics, formulated as drug delivery systems per se, that take the drug to the site of action, maximize its efficacy, and provide optical detectability are envisaged as the future in fighting against infections. Their role as a tool against multiresistant strains remains as interesting challenge open for further research.; Ternary cyclodextrin- arginine- ciprofloxacin complexes show improved stability and increased efficacy against P. aeruginosa in Galleria mellonella worms.

JTD Keywords: Antibiotic-resistance, Beta-cyclodextrin, Dissolution, Drugs, Salts

Caballero-Briones, F., Palacios-Padros, A., Calzadilla, O., Sanz, F., (2010). Evidence and analysis of parallel growth mechanisms in Cu2O films prepared by Cu anodization Electrochimica Acta 55, (14), 4353-4358

We have studied the preparation of Cu2O films by copper anodization in a 0.1 M NaOH electrolyte. We identified the potential range at which Cu dissolution takes place then we prepared films with different times of exposure to this potential. The morphology, crystalline structure, band gap. Urbach energy and thickness of the films were studied. Films prepared with the electrode unexposed to the dissolution potential have a pyramidal growth typical of potential driven processes, while samples prepared at increasing exposure times to dissolution potential present continuous nucleation, growth and grain coalescence. We observed a discrepancy in the respective film thicknesses calculated by coulometry, atomic force microscopy and optical reflectance. We propose that anodic Cu2O film formation involves three parallel mechanisms (i) Cu2O nucleation at the surface, (ii) Cu+ dissolution followed by heterogeneous nucleation and (iii) Cu+ and OH- diffusion through the forming oxide and subsequent reaction in the solid state.

JTD Keywords: Cuprous oxide, Anodic films, Reflectance, Thickness, Band gap, Urbach tail parameter, Dissolution, Growth mechanism