by Keyword: Copper indium thiophosphate
Checa, M, Jin, X, Millan-Solsona, R, Neumayer, SM, Susner, MA, McGuire, MA, O'Hara, A, Gomila, G, Maksymovych, P, Pantelides, ST, Collins, L, (2022). Revealing Fast Cu-Ion Transport and Enhanced Conductivity at the CuInP2S6?In4/3P2S6 Heterointerface Acs Nano 16, 15347-15357 
Van der Waals layered ferroelectrics, such as CuInP2S6 (CIPS), offer a versatile platform for miniaturization of ferroelectric device technologies. Control of the targeted composition and kinetics of CIPS synthesis enables the formation of stable self-assembled heterostructures of ferroelectric CIPS and nonferroelectric In4/3P2S6 (IPS). Here, we use quantitative scanning probe microscopy methods combined with density functional theory (DFT) to explore in detail the nanoscale variability in dynamic functional properties of the CIPS-IPS heterostructure. We report evidence of fast ionic transport which mediates an appreciable out-of-plane electromechanical response of the CIPS surface in the paraelectric phase. Further, we map the nanoscale dielectric and ionic conductivity properties as we thermally stimulate the ferroelectric-paraelectric phase transition, recovering the local dielectric behavior during this phase transition. Finally, aided by DFT, we reveal a substantial and tunable conductivity enhancement at the CIPS/IPS interface, indicating the possibility of engineering its interfacial properties for next generation device applications.
JTD Keywords: copper indium thiophosphate, diffusion, elastic band method, ferroelectrics, ionic conductor, migration, nanoscale, phase transition, piezoresponse force microscopy, scanning dielectric microscopy, transition, Copper indium thiophosphate, Initio molecular-dynamics, Scanning dielectric microscopy
