Publications

Implants for orthopedic applications need to be biocompatible and bioactive, with mechanical properties similar to those of surrounding natural bone. Given this scenario titanium (Ti) scaffolds obtained by Direct Ink Writing technique offer the opportunity to manufacture customized structures with controlled porosity and mechanical properties. Considering that 3D Ti scaffolds have a significant surface area, it is necessary to develop strategies against the initial bacterial adhesion in order to prevent infection in the early stages of the implantation, while promoting cell adhesion to the scaffold. The challenge is not only achieving a balance between antibacterial activity and osseointegration, it is also to develop a homogeneous coating on the inner and outer surface of the scaffold. The purpose of this work was the development of a single-step electrodeposition process in order to uniformly cover Ti scaffolds with a layer of calcium phosphate (CaP) loaded with chlorhexidine digluconate (CHX). Scaffold characterization was assessed by scanning electron microscopy, Energy dispersive X-ray spectroscopy, X-ray diffraction, micro-Raman microscopy and compressive strength tests. Results determined that the surface of scaffolds was covered by plate-like and whisker-like calcium phosphate crystals, which main phases were octacalcium phosphate and brushite. Biological tests showed that the as-coated scaffolds reduced bacteria adhesion (73 +/- 3% for Staphylococcus aureus and 70 +/- 2% for Escherichia coli). In vitro cell studies and confocal analysis revealed the adhesion and spreading of osteoblast-like SaOS-2 on coated surfaces. Therefore, the proposed strategy can be a potential candidate in bone replacing surgeries.

JTD Keywords: Antibacterial, Bacterial, Behavior, Biocompatibility, Calcium phosphate coating, Chlorhexidine, Chlorhexidine digluconate, Deposition, Electrodeposition, Hydroxyapatite coatings, Implants, One-step pulse electrodeposition, Plasma-spray, Release, Surface, Titanium scaffolds

The purpose of this systematic study was to investigate the effects of specific substrates and potential conditions applied while tailoring the morphology and chemical composition of nanostructured Co films. In particular, Co electrodeposition in sustainable choline chloride-urea deep eutectic solvent was assessed, using glassy carbon and two metals widely employed in electrocatalysis and biocompatible purposes, Pt and Au, as substrates for modification with Co. Various in situ electrochemical techniques were combined with a broad range of ex-situ characterization and chemical-composition techniques for a detailed analysis of the prepared Co films. Among the results, nanostructured Co films with high extended active surface areas and variable composition of oxo and hydroxyl species could be tuned by simply modulating the applied potential limits, and without using additives or surfactant agents. The study highlights the effectiveness of using deep eutectic solvent as suitable electrolyte for surface modification by controlled deposition of nanostructured Co films with further application in electrocatalysis.

JTD Keywords: Cobalt electrodeposition, Deep eutectic solvent, First growth stages, Substrate influence

Metallic implants have some limitations related to bioactivity and bacteria colonization leading to infections. In this regard, calcium phosphate coatings can be used as carrier for drug delivery in order to improve the mentioned drawbacks. The present work proposes the introduction of an antibacterial agent in the course of a pulsed and reverse pulsed electrodeposition. Calcium phosphate coatings were prepared in 30 min using different pulse waveforms (unipolar-bipolar), current densities (2–5 mA/cm2) and temperatures (40–60 °C). Mechanical stability of the as-coated surfaces was studied in order to select the optimal electrodeposition conditions. Subsequently, selected coatings were loaded with an antiseptic agent, chlorhexidine digluconate (CHX), via a single-step co-deposition procedure. CHX concentration added to the electrolyte was adjusted to 3 mM based on the antibacterial efficacy of the loaded coatings evaluated in vitro with Staphylococcus aureus and Escherichia coli bacteria strains. Whereas the same chlorhexidine concentration was added to the electrolyte, results showed that the amount of CHX loaded was different for each condition while release kinetics was maintained. The results of this work demonstrate that a pulsed co-deposition strategy has great potential to modulate local delivery of antibacterial agents such as chlorhexidine digluconate, which may prevent early phase infections of metallic implants after insertion.

JTD Keywords: Antibacterial agent, Calcium phosphate, Characterization, Coating, Pulse electrodeposition, Titanium

Cyanide based silver electroplating is a low-cost reliable and well-established process for metal deposition. However, delicate handling during the process is needed because of the high toxicity of cyanide, for the persons and the environment. Uracil based silver electrodeposition got the attention of this field, because of its low cost and non-toxic nature. However, little is known about the silver complexation with uracil and the process behind the silver electroplating. In this work, we studied a hitherto unknown phenomenon on the diverse structure’s formation of silver uracil coordination complex due to the presence of different alkaline counterions. The distinct structuration of this complex clearly impacts on the efficiency and deposition yields of silver electroplating. We demonstrate the unknown key role that play hydroxide counterions in the uracil-silver coordination, and the different molecular structures created on the basis of the used counterion. The hydroxide counterion determines monomeric and polymeric complex formation with silver, which affects the solubility of the uracil silver complex and its subsequent electrodeposition. The different molecular complexes were characterized by FT-IR, UV–vis, DRUV–vis and multi-nuclear NMR spectroscopy and the silver electrodeposition by cyclic voltammetry and TOF-SIMS. This study sheds some light in the improvement of silver electroplating process

JTD Keywords: Coordination complex, Electrometallization, Electroplating, Metal complex, Silver electrodeposition, Uracil

The first steps of nickel electrodeposition in a deep eutectic solvent (DES) are analyzed in detail. Several substrates from glassy carbon to Pt(111) were investigated pointing out the surface sensitivity of the nucleation and growth mechanism. For that, cyclic voltammetry and chronoamperometry, in combination with scanning electron microscopy (SEM), were employed. X-ray diffraction (XRD) and atomic force microscopy (AFM) were used to more deeply analyze the Ni deposition on Pt substrates. In a 0.1 M NiCl2 + DES solution (at 70 °C), the nickel deposition on glassy carbon takes place within the potential limits of the electrode in the blank solution. Although, the electrochemical window of Pt|DES is considerably shorter than on glassy carbon|DES, it was still sufficient for the nickel deposition. On the Pt electrode, the negative potential limit was enlarged while the nickel deposit grew, likely because of the lower catalytic activity of the nickel toward the reduction of the DES. At lower overpotentials, different hydrogenated Ni structures were favored, most likely because of the DES co-reduction on the Pt substrate. Nanometric metallic nickel grains of rounded shape were obtained on any substrate, as evidenced by the FE-SEM. Passivation phenomena, related to the formation of Ni oxide and Ni hydroxylated species, were observed at high applied overpotentials. At low deposited charge, on Pt(111) the AFM measurements showed the formation of rounded nanometric particles of Ni, which rearranged and formed small triangular arrays at sufficiently low applied overpotential. This particle pattern was induced by the (111) orientation and related to surface sensitivity of the nickel deposition in DES. The present work provides deep insights into the Ni electrodeposition mechanism in the selected deep eutectic solvent.

JTD Keywords: AFM, Deep eutectic solvent, Glassy carbon, Nanostructures, Nickel electrodeposition, Platinum electrode, Pt(111), SEM, Surface sensitive

CuInSe2 films were prepared onto Cu-cladded substrates by ultrasonic-assisted electrodeposition using different bath compositions and a fixed deposition potential of E=-1500 mV vs Ag/AgCl. In situ electrochemical treatments named selenization and electrocrystallization, in a Se4+ electrolyte were applied to modify the morphology, film structure and the phase composition. Films were characterized by scanning electron microscopy, X-ray diffraction, Raman spectroscopy and photocurrent response. A Cu2-xSe layer develops as the electrode is introduced into the electrolyte. The presence of Cu-In, In-Se, Cu-Se, cubic, hexagonal and tetragonal CuInSe2 phases as well as elemental In and Se was observed. After selenization, partial phase dissolution and Se deposition is observed and after the electrocrystallization treatment the secondary phases such as Cu-Se, Cu-In, In and Se reduce substantially and the grain sizes increase, as well as the photocurrent response. Phase diagrams are constructed for each set of films and reaction mechanisms are proposed to explain the phase evolution.

JTD Keywords: CuInSe2, Electrodeposition, In situ electrochemical treatments, Phase composition, Surface modification

p-Type semiconducting copper indium diselenide thin films have been prepared onto In2O3:Sn substrates by a recently developed pulse electrodeposition method that consists in repeated cycles of three potential application steps. The Cu–In–Se electrochemical system and the related single component electrolytes were studied by cyclic voltammetry to identify the electrode processes and study the deposition processes. In situ atomic force microscopy measurements during the first 100 deposition cycles denote a continuous nucleation and growth mechanism. Particles removed by film sonication from some of the films were characterized by transmission electron microscopy and determined to consist in nanoscopic and crystalline CuInSe2. The remaining film is still crystalline CuInSe2, as assessed by X-ray diffraction. The chemical characterization by combined X-ray photoelectron spectroscopy, X-ray fluorescence and inductively coupled plasma optical emission spectroscopy, showed that films were Cu-poor and Se-poor. Raman characterization of the as-grown films showed that film composition varies with film thickness; thinner films are Se-rich, while thicker ones have an increased Cu–Se content. Different optical absorption bands were identified by the analysis of the UV–NIR transmittance spectra that were related with the presence of CuInSe2, ordered vacancy compounds, Se, Cu2−xSe and In2Se3. The photoelectrochemical activity confirmed the p-type character and showed a better response for the films prepared with the pulse method.

JTD Keywords: CuInSe2, Solar cells, Electrodeposition, Optical properties, As-deposited films, ITO substrate

P-type copper indium diselenide (CuInSe2) films have been prepared onto ITO substrates by an electrodeposition method, that sequentially applies potential pulses at the deposition potential of each element Cu, Se and In, and then step it back in cyclically to induce the solid state reaction between the elements. Two electrolyte concentrations as well as three different pulse durations were assessed. The resulting films were compared with those deposited at fixed electrode potentials. As-grown films are nanocrystalline and have an E-g similar to 0.95 eV. Raman spectroscopy shows that Se and Cu-Se contents decrease while pulse duration increases and electrolyte concentration decreases. Cu-Se phases are even absent for films grown at the low electrolyte concentration. These results represent a great improvement in the film phase purity reducing the need of post-deposition treatments.

JTD Keywords: CIS, Pulsed electrodeposition, Raman, Solar cells